Solder Reflow Profile
Recommended reflow condition as per JEDEC Standard, J-STD-020 (latest revision). Non-Halide Flux should be used.
Regulatory Information
The ACPL-061L, ACPL-C61L, ACNW261L and are pending approval by the following organizations:
IEC/EN/DIN EN 60747-5-5 (Option 060E only)
UL
Approval under UL 1577, component recognition program up to V = 3750 V
for ACPL-061L and V = 5000 V
RMS
ISO
RMS
ISO
for ACPL-C61L/ACNW261L File E55361.
CSA
Approval under CSA Component Acceptance Notice #5, File CA 88324.
Insulation and Safety Related Specifications
Parameter
Symbol
ACPL-061L ACPL-C61L ACNW261L Unit
Conditions
Minimum External Air Gap
(External Clearance)
L(101)
4.9
8
9.6
mm
Measured from input terminals to
output terminals, shortest distance
through air.
Minimum External
Tracking (External Creepage)
L(102)
4.8
8
10
mm
mm
Measured from input terminals to
output terminals, shortest distance
path along body.
Minimum Internal Plastic Gap
(Internal Clearance)
0.08
0.5
1.0
Through insulation distance conductor
to conductor, usually the straight line
distance thickness between the
emitter and detector.
Tracking Resistance
(Comparative Tracking Index)
CTI
175
IIIa
175
IIIa
175
IIIa
V
DIN IEC 112/VDE 0303 Part 1
Isolation Group
Material Group (DIN VDE 0110, 1/89,
Table 1)
5
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