APExx16 Series
6.2 Bonding Diagram of APE8416 /APE10616 /APE12716
23
22
17
25
21
18
16
20
24
19
26
GND1
PRC2
PRB3
PRC3
PRC1
PRD3
PRD0
PRC0
PRD2
PRD1
Vdd1
ROM
Chip Size : 2288 um x 2364 um
Pad Size : 80 um x 80 um
Y
* The IC substrate must be connected to GND.
1
GND4
GND3
2
GND2
15
PWM1
Vdd3
3
PRB1
9
PRB2
10
Vdd2
6
PRB0
8
OSC1
7
PRA0 PRA1
PRA2 PRA3
PWM2/Cout
5
13
14
11
12
4
(0,0)
X
Pad #
1
Pad Name
GND4
X
Y
Pad #
14
Pad Name
PRA3
X
Y
76
59
59
404
294
146
59
2109
2128
1927
1765
1603
1441
1279
1117
955
76
2
15
GND3
GND2
GND1
PRD0
212
2204
2204
2204
2204
2204
2204
2204
2204
2204
2204
2204
3
16
PWM1
4
17
Vdd3
183
467
5
18
PWM2/Cout
Vdd2
59
PRD1
6
19
815
76
PRD2
7
20
OSC1
976
76
PRD3
8
21
PRB0/OSC2
PRB1/IR
PRB2
1140
1304
1465
1626
1787
1948
76
PRC0
9
22
76
PRC1
10
11
12
13
76
23
PRC2
739
24
PRA0
76
PRC3
631
PRA1
76
25
PRB3/Reset
Vdd1
469
26
PRA2
76
307
7
Rev 1.1
2003/9/2
APLUS [ APLUS INTERGRATED CIRCUITS ]
