APExx16 Series
6.0 Bonding Diagram of APE1016 /APE1516 /APE2016
25
24
23
22
21
20
19
GND1
PRD0
PRD1
PRD2
PRD3
PRC0
ROM
PRC1
PRC2
Chip Size : 1432 um x 1650 um
Pad Size : 80 um x 80 um
18
17
1
Vdd3
PRC3
PRB0
* The IC substrate must be connected to GND.
16
Y
PWM2/Cout
Vdd2
2
OSC1 15
14
GND2
3
Vdd1
13
PRB3 PRB2
PRB1
12
PRA0
9
PRA2
7
PRA1
8
PRA3
6
GND3
PWM1
4
10
11
5
(0,0)
X
Pad #
1
Pad Name
Vdd3
X
Y
Pad #
Pad Name
GND2
X
Y
14
15
16
17
18
19
20
21
22
23
24
25
56
647
466
182
58
58
87
87
87
87
87
87
87
87
1261
1261
1261
1261
1261
1261
1261
1261
1261
1261
1261
1261
235
2
PWM2/Cout
Vdd2
58
58
OSC1
350
3
PRB0/OSC2
PRC3
465
4
PWM1
GND3
145
293
580
5
PRC2
695
6
PRA3
413
PRC1
810
7
PRA2
533
PRC0
925
8
PRA1
653
PRD3
1040
1155
1270
1385
1500
9
PRA0
773
PRD2
10
11
12
13
PRB3/Reset
PRB2
893
PRD1
1013
1133
1253
PRD0
PRB1/IR
Vdd1
GND1
5
Rev 1.1
2003/9/2
APLUS [ APLUS INTERGRATED CIRCUITS ]
