APExx16 Series
6.1 Bonding Diagram of APE3116 /APE4116 /APE6316
25
24
GND1
PRD0
PRD1 23
ROM
22
PRD2
PRD3
PRC0
21
20
19
18
17
16
PRC1
PRC2
PRC3
PRB0
Chip Size : 1408 um x 2556 um
Pad Size : 80 um x 80 um
* The IC substrate must be connected to GND.
1
Vdd3
Y
15
14
13
OSC1
PRB1
GND2
PWM2/Cout
2
Vdd2
3
PRB3 PRB2
Vdd1
12
PRA0
9
PRA2 PRA1
PRA3
6
GND3
PWM1
4
8
10
11
7
5
(0,0)
X
Pad #
1
Pad Name
X
Y
Pad #
14
Pad Name
PRB1/IR
OSC1
X
Y
Vdd3
56
647
466
182
58
1248
1248
1248
1248
1248
1248
1248
1248
1248
1248
1248
1248
405
2
15
PWM2/Cout
Vdd2
58
58
570
3
16
PRB0/OSC2
PRC3
733
4
17
PWM1
GND3
145
293
430
563
696
829
962
1095
1228
1248
896
5
18
58
PRC2
1056
1218
1379
1540
1700
1861
2022
2310
6
19
PRA3
87
PRC1
7
20
PRA2
87
PRC0
8
21
PRA1
87
PRD3
9
22
PRA0
87
PRD2
10
11
12
13
23
PRB3/Reset
PRB2
87
PRD1
87
24
PRD0
25
Vdd1
87
GND1
GND2
272
6
Rev 1.1
2003/9/2
APLUS [ APLUS INTERGRATED CIRCUITS ]
