March 2001
AS29LV800
®
Thin small outline package (TSOP-I)
e
b
Package dimensions
48-pin
12×20
Min
Max
1.27
0.15
1.05
0.27
c
A
A1
A2
b
–
A2
A
A1
0.05
0.95
0.17
L
pin 1
pin 48
D
Hd
c
0.15 nominal
D
18.20
18.60
e
0.50 nominal
E
11.90
19.80
0.50
0°
12.10
20.20
0.70
5°
Hd
L
pin 24
pin 25
48-pin
α
α
E
Small Outline Plastic (SO)
Package dimensions
c
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
JEDEC MO - 175 AA
44-pin SO
Min (mm) Max (mm)
H
e
SO
e
A
A1
A2
b
–
3.1
–
0.05
2.5
2.9
0.45
0–10°
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20 21 22
0.25
c
0.09
28.0
12.4
0.25
28.4
12.8
d
d
e
A2
l
A
E
1.27 (typical)
16.05 (typical)
0.73 1.3
He
l
A1
b
E
3/22/01; V.1.0
Alliance Semiconductor
P. 24 of 25
ANADIGICS [ ANADIGICS, INC ]
