AS1530/AS1531
Data Sheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-
istics on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
-0.3
-0.3
Max
+7
Units
Comments
VDD1, VDD2, VDD3 to GND
VDD1 to VDD2 to VDD3
V
V
+0.3
VDD1 +
+0.3
CH0:CH7, COM to GND
REF, REFADJ to GND
DIN, SCLK, CSN, to GND
-0.3
-0.3
-0.3
-0.3
V
V
V
VDD1 +
+0.3
VDD2 +
+0.3
VDD2 +
+0.3
DOUT, SSTRB to GND
V
DOUT, SSTRB Sink Current
25
mA
mW
Continuous Power Dissipation
(TAMB = +70ºC)
559
Derate 7.0mW/ºC above +70ºC
Operating Temperature Range
Storage Temperature Range
-40
-60
+85
ºC
ºC
+150
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Package Body Temperature
+260
ºC
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