AS1367
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
IN, POK to GND
OUT to GND
BYP to GND
Output Short-Circuit Duration
Continuous Power Dissipation
Operating Temperature Range
Junction Temperature T
J
Thermal Resistance
Θ
JA
Storage Temperature Range
-65
-40
Min
-0.3
-0.3
-0.3
Indefinite
300
+85
+150
+140
+150
Max
+7
V
IN
+ 0.3
V
OUT
+ 0.3
Typ
Units
V
V
V
V
mW
ºC
ºC
ºC/W
ºC
The reflow peak soldering temperature
(body temperature) specified is in
accordance with
IPC/JEDEC J-STD-
020D “Moisture/Reflow Sensitivity
Classification for non-hermetic Solid
State Surface Mount Devices”
Internally limited
Derate 7.1mW/ºC above +70ºC
Comments
Package Body Temperature
+260
ºC
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