AS1358 / AS1359
Datasheet - Package Drawings and Markings
10 Package Drawings and Markings
The devices are available in a TSOT23 5-pin package.
Figure 22. TSOT23 5-pin Package
Symbol
Min
Typ
Max
1.00
0.10
0.90
0.45
0.39
0.20
Notes
Symbol
Min
Typ
0.40
Max
Notes
A
A1
A2
b
L
L1
L2
N
0.30
0.50
0.01
0.84
0.30
0.31
0.12
0.05
0.87
0.60REF
0.25BSC
5
b1
c
0.35
0.15
R
0.10
0.10
R1
0.25
8º
c1
0.08
0.13
0.16
0º
4º
4º
1
D
E
2.90BSC
2.80BSC
1.60BSC
0.95BSC
1.90BSC
3,4
3,4
3,4
10º
12º
Tolerances of Form and Position
E1
e
aaa
bbb
ccc
ddd
0.15
0.25
0.10
0.20
e1
Notes:
1. Dimensioning and tolerancing conform to ASME Y14.5M - 1994.
2. Dimensions are in millimeters.
3. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall not exceed 0.15mm per
end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15mm per side. Dimen-
sions D and E1 are determined at datum H.
4. The package top can be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic
body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but include any mistmatches between the top of the package
body and the bottom. D and E1 are determined at datum H.
www.austriamicrosystems.com
Revision 1.5
13 - 16
AMSCO [ AMS(艾迈斯) ]
