AS1339
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 2. Absolute Maximum Ratings
IN1A, IN1B, IN2 to AGND
PAA, PAB, PA_EN, TEST, REFIN,
NC to AGND
LDO1, LDO2, EN1, EN2 to AGND
REFIN Common-Mode Range
IN2 to IN1B/IN1A
PGND to AGND
LX Current
Bypass Current
-0.3
-0.3
-0.3
0
-0.3
-0.3
+7
V
IN1A
/
V
IN1B
+
0.3
V
IN2
+
0.3
V
IN
+0.3
+0.3
0.8
1.6
V
V
V
V
V
V
A
RMS
A
RMS
kV
ºC
Storage Temperature Range
Package Body Temperature
Continuous Power Dissipation
P
D-MAX
Junction Temperature (T
J
) Range
Ambient Temperature (T
A
) Range
Te
c
hn
ic a
al m
co s
A
nt G
en
ts
til
Human Body Model
1
-65
+150
+260
ºC
0.75
W
-40
+125
ºC
-40
+85
ºC
Revision 1.05
HBM MIL-Std. 883E 3015.7
methods
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020D “Moisture/Reflow
Sensitivity Classification for Non-Hermetic Solid
State Surface Mount Devices”.
T
A
= +65ºC; derate 12.5mW/ºC above +65ºC
In applications where high power dissipation
and/or poor package thermal resistance is
present, the maximum ambient temperature
may have to be derated.
Maximum ambient temperature (T
A-MAX
) is
dependent on the maximum operating junction
temperature (T
J-MAX-OP
= 125ºC), the maximum
power dissipation
of the device in the application (P
D-MAX
), and the
junction-to ambient thermal resistance of the
part/package in the application (θ
JA
), as given by
the following
equation: T
A-MAX
= T
J-MAX-OP
– (θ
JA
× P
D-MAX
).
lv
4 - 25
al
id
Parameter
Min
Max
Units
Comments
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