AS1310
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
Table 2
may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in
Electrical Characteristics on page 4
is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
VIN, VOUT, EN, LBI, LBO to GND
LX, REF to GND
Input Current (latch-up immunity)
Electrostatic Discharge
Electrostatic Discharge HBM
Temperature Ranges and Storage Conditions
Thermal Resistance
θ
JA
Junction Temperature
58
ºC/W
ºC
ºC
+125
+125
±2
kV
-0.3
-0.3
-100
+5
V
OUT
+ 0.3
100
V
V
mA
Norm: JEDEC 78
Min
Max
Units
Comments
Norm: MIL 883 E method 3015
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Storage Temperature Range
-55
Package Body Temperature
+260
ºC
Humidity non-condensing
Moisture Sensitive Level
5
85
%
1
Revision 1.8
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded packages is matte
tin (100% Sn).
Represents a maximum floor life time of unlimited
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3 - 19
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AMSCO [ AUSTRIAMICROSYSTEMS AG ]
