AS1152
austriamicrosystems
Data Sheet
4 Absolute Maximum Ratings
Stresses beyond those listed in Table 1 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in the operational sec-
tions of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 1. Absolute Maximum Ratings
Parameter
VCC to GND
Limits
-0.3 to +5.0
Units
Notes
V
V
V
INx, EN, ENn to GND
OUTx+, OUTx- to GND
-0.3 to (VCC + 0.3)
-0.3 to +5
Short Circuit Duration (OUTx+,
OUTx-)
Continuous
755
Continuous Power Dissipation
(TA = +70°C)
mW
Derate 9.4mW/°C Above +70°C
Storage Temperature Range
Maximum Junction Temperature
Operating Temperature Range
-65 to +150
+150
ºC
ºC
ºC
-40 to +85
The reflow peak soldering temperature (body
temperature) specified is in compliance with IPC/
JEDEC J-STD-020C “Moisture/ Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
Package Body Temperature
ESD Protection
260
±4
ºC
kV
Human Body Model, INx, OUTx+, OUTx--
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