AS1152
austriamicrosystems
Data Sheet
Board Layout
10 Package Drawings and Markings
Figure 23. 16-pin TSSOP Package
Notes:
Symbol
A
Min
-
Typ
-
-
0.90
0.60
-
Max
1.10
0.15
0.95
0.75
-
Notes
1,2
1,2
1,2
1,2
1,2
1,2
1,2,5
1,2
1,2
1,2
1,2
1,2
1,2
1,2
1,2
1,2
1,2
1,2
1,2
1. All dimensions are in millimeters; angles in degrees.
A1
A2
L
R
R1
b
b1
c
c1
0.05
0.85
0.50
0.09
0.09
0.19
0.19
0.09
0.09
0º
2. Dimensioning and tolerancing per ASME Y14.5M – 1994.
3. Dimension D does not include mold flash, protrusions, or gate
burrs. Mold flash, protrusions, and gate burrs shall not exceed
0.15mm per side.
-
-
-
4. Dimension E1 does not include interlead flash or protrusion.
Interlead flash or protrusions shall not exceed 0.25mm per
side.
0.30
0.25
0.20
0.16
8º
0.22
-
-
5. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm total in excess of the b
dimension at maximum material condition. Dambar cannot be
located on the lower radius of the foot.
θ1
-
L1
aaa
bbb
ccc
ddd
e
1.0REF
0.10
0.10
0.05
0.20
0.65BSC
12ºREF
12ºREF
Variations
5.00
4.40
6.4BSC
0.65BSC
16
6. Terminal numbers are for reference only.
7. Datums A and B to be determined at datum plane H.
8. Dimensions D and E1 are to be determined at datum plane H.
9. This dimension applies only to variations with an even number
of leads per side.
θ2
θ3
10. Cross section A-A to be determined at 0.10 to 0.25mm from
the leadtip.
D
E1
E
e
N
4.90
4.30
5.10 1,2,3,8
4.50 1,2,4,8
1,2
1,2
1,2,6
www.austriamicrosystems.com
Revision 1.00
13 - 15
AMSCO [ AMS(艾迈斯) ]
