AS1130
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in
is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
VDD to GND
All other pins to GND
Sink Current
Segment Current
Input Current (latch-up immunity)
Electrostatic Discharge
Electrostatic Discharge HBM
Junction Temperature
2
kV
ºC
Temperature Ranges and Storage Conditions
-100
-0.3
-0.3
7
7 or
V
DD
+ 0.3
500
100
100
V
V
mA
mA
mA
Norm: JEDEC 78
Min
Max
Units
Comments
Te
c
hn
ic a
al m
co s
A
nt G
en
ts
til
Norm: MIL 883 E method 3015
+150
Storage Temperature Range
-55
-55
+125
+150
ºC
ºC
for 20-pin WL-CSP
for 28-pin SSOP
Package Body Temperature
+260
ºC
Humidity non-condensing
5
85
%
1
3
Moisture Sensitive Level
28-pin
SSOP
Revision 1.07
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC
J-STD-020“Moisture/Reflow Sensitivity Classification for
Non-Hermetic Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
20-pin
WL-CSP Represents a max. floor life time of unlimited
Represents a max. floor life time of 168h
lv
3 - 38
al
id
AMSCO [ AUSTRIAMICROSYSTEMS AG ]
