AMD
TYPICAL THERMAL CHARACTERISTICS
/4 Devices (PALCE16V8H-10/4)
Measured at 25°C ambient. These parameters are not tested.
Typ
Parameter
Symbol
Parameter Description
PDIP
25
PLCC
22
Unit
θjc
Thermal Impedance, Junction to Case
Thermal Impedance, Junction to Ambient
Thermal Impedance, Junction to Ambient with Air Flow
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
θja
71
64
θjma
200 Ifpm air
400 Ifpm air
600 Ifpm air
800 Ifpm air
61
55
55
51
51
47
47
45
/5 Devices (PALCE16V8H-7/5)
Measured at 25°C ambient. These parameters are not tested.
Typ
Parameter
Symbol
Parameter Description
PDIP
29
70
64
58
53
X
PLCC
23
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
θjc
Thermal Impedance, Junction to Case
Thermal Impedance, Junction to Ambient
Thermal Impedance, Junction to Ambient with Air Flow
θja
61
θjma
200 Ifpm air
400 Ifpm air
600 Ifpm air
800 Ifpm air
53
47
44
X
Plastic θjc Considerations
The data listed for plastic θjc are for reference only and are not recommended for use in calculating junction temperatures. The
heat-flow paths in plastic-encapsulated devices are complex, making the θjc measurement relative to a specific location on the
package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the
package. Furthermore, θjc tests on packages are performed in a constant-temperature bath, keeping the package surface at a
constant temperature. Therefore, the measurements can only be used in a similar environment.
PALCE16V8 Family
2-61
AMD [ AMD ]
