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AM29LV800DT-70EC 参数 Datasheet PDF下载

AM29LV800DT-70EC图片预览
型号: AM29LV800DT-70EC
PDF下载: 下载PDF文件 查看货源
内容描述: 8兆位( 1一M× 8位/ 512的K× 16位) CMOS 3.0伏只引导扇区闪存 [8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory]
分类和应用: 闪存内存集成电路光电二极管
文件页数/大小: 51 页 / 1726 K
品牌: AMD [ AMD ]
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P R E L I M I N A R Y  
the high impedance state, independent of the  
Writing Commands/Command Sequences  
OE# input.  
To write a command or command sequence  
(which includes programming data to the device  
and erasing sectors of memory), the system  
must drive WE# and CE# to VIL, and OE# to  
VIH.  
The device enters the CMOS standby mode  
when the CE# and RESET# pins are both held at  
VCC 0.3 V. (Note that this is a more restricted  
voltage range than VIH.) If CE# and RESET# are  
held at VIH, but not within VCC 0.3 V, the device  
will be in the standby mode, but the standby  
current will be greater. The device requires stan-  
dard access time (tCE) for read access when the  
device is in either of these standby modes,  
before it is ready to read data.  
For program operations, the BYTE# pin deter-  
mines whether the device accepts program data  
in bytes or words. Refer to “Word/Byte Configu-  
ration” for more information.  
The device features an Unlock Bypass mode to  
facilitate faster programming. Once the device  
enters the Unlock Bypass mode, only two write  
cycles are required to program a word or byte,  
instead of four. The “Word/Byte Program  
Command Sequence” section has details on pro-  
gramming data to the device using both stan-  
dard and Unlock Bypass command sequences.  
If the device is deselected during erasure or pro-  
gramming, the device draws active current until  
the operation is completed.  
In the DC Characteristics table, ICC3 and ICC4  
represents the standby current specification.  
Automatic Sleep Mode  
An erase operation can erase one sector, mul-  
tiple sectors, or the entire device. Tables 2 and  
3 indicate the address space that each sector  
occupies. A “sector address” consists of the  
address bits required to uniquely select a sector.  
The “Command Definitions” section has details  
on erasing a sector or the entire chip, or sus-  
pending/resuming the erase operation.  
The automatic sleep mode minimizes Flash  
device energy consumption. The device auto-  
matically enables this mode when addresses  
remain stable for tACC + 30 ns. The automatic  
sleep mode is independent of the CE#, WE#,  
and OE# control signals. Standard address  
access timings provide new data when  
addresses are changed. While in sleep mode,  
output data is latched and always available to  
the system. ICC4 in the DC Characteristics table  
represents the automatic sleep mode current  
specification.  
After the system writes the autoselect command  
sequence, the device enters the autoselect  
mode. The system can then read autoselect  
codes from the internal register (which is sepa-  
rate from the memory array) on DQ7–DQ0.  
Standard read cycle timings apply in this mode.  
Refer to the “Autoselect Mode” and “Autoselect  
Command Sequence” sections for more infor-  
mation.  
RESET#: Hardware Reset Pin  
The RESET# pin provides a hardware method of  
resetting the device to reading array data. When  
the RESET# pin is driven low for at least a  
period of tRP, the device immediately termi-  
nates any operation in progress, tristates all  
output pins, and ignores all read/write com-  
mands for the duration of the RESET# pulse.  
The device also resets the internal state  
machine to reading array data. The operation  
that was interrupted should be reinitiated once  
the device is ready to accept another command  
sequence, to ensure data integrity.  
ICC2 in the DC Characteristics table represents  
the active current specification for the write  
mode. The “AC Characteristics” section contains  
timing specification tables and timing diagrams  
for write operations.  
Program and Erase Operation Status  
During an erase or program operation, the  
system may check the status of the operation by  
reading the status bits on DQ7–DQ0. Standard  
read cycle timings and ICC read specifications  
apply. Refer to “Write Operation Status” for  
more information, and to “AC Characteristics”  
for timing diagrams.  
Current is reduced for the duration of the  
RESET# pulse. When RESET# is held at  
VSS±0.3 V, the device draws CMOS standby  
current (ICC4). If RESET# is held at VIL but not  
within VSS±0.3 V, the standby current will be  
greater.  
Standby Mode  
The RESET# pin may be tied to the system reset  
circuitry. A system reset would thus also reset  
the Flash memory, enabling the system to read  
the boot-up firmware from the Flash memory.  
When the system is not reading or writing to the  
device, it can place the device in the standby  
mode. In this mode, current consumption is  
greatly reduced, and the outputs are placed in  
January 21, 2005 Am29LV800D_00_A4_E  
Am29LV800D  
11  
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