Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150°C for prolonged periods of time.
Special Handling Instructions for FBGA
Packages
Special handling is required for Flash Memory products
in FBGA packages.
PIN CONFIGURATION
A0–A20=21 addresses
LOGIC SYMBOL
21
DQ0–DQ7=8 data inputs/outputs
CE# = Chip enable
A0–A20
8
DQ0–DQ7
OE# = Output enable
WE# = Write enable
CE#
OE#
RESET#=Hardware reset pin, active low
RY/BY#=Ready/Busy output
WE#
RESET#
V
= 3.0 volt-only single power supply
(see Product Selector Guide for speed
options and voltage supply tolerances)
CC
RY/BY#
V
= Device ground
SS
NC = Pin not connected internally
Am29LV017D
11
AMD [ AMD ]
