D A T A S H E E T
This data sheet will be marked preliminary until the de-
vice has been in full production for a number of months.
Revision E+3 (June 4, 2004)
Ordering Information
The -75 speed option (70 ns, 5% V ) has been re-
CC
Added Lead-free (Pb-free) options to the Temperature
Range breakout of the OPN table and the Valid Combi-
nations table..
placed by a -70 speed option (70 ns, 10 V ).
CC
The burn-in option is no longer available.
Revision E+4 (January 4, 2006)
Global
The device now has the Unlock Bypass Program
feature.
The publication number of the document describing
sector protection/unprotection implementation is now
23922.
Deleted 150 speed option
Deleted TSR048 48-pin Reverse Thin Small Outline
Package Option
Revision E+1 (December 4, 2000)
Global
Deleted TSR040 40-pin Reverse Thin Small Outline
Package Option
Added table of contents. Removed Preliminary status
from document.
Revision E5 (July 27, 2006)
Global
Revision E+2 (March 23, 2001)
Common Flash Memory Interface (CFI)
Added section.
Added product availability notice to cover page and first
page of data sheet.
AC Characteristics
Table 9, Am29F016D Command Definitions
Erase/Program Operations table: Changed t
to a
BUSY
maximum specification.
Corrected the addresses for the three-cycle unlock by-
pass command sequence. Added Note 9 and CFI
Query command to table.
Revision E6 (November 2, 2006)
Global
Deleted product availability notice to cover page and
first page of data sheet.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion Inc. will not be liable
to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign
Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-
thorization by the respective government entity will be required for export of those products.
Trademarks
Copyright ©2006 Spansion Inc. All rights reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof, are
trademarks of Spansion Inc. Other company and product names used in this publication are for identification purposes only and may be trade-
marks of their respective companies
Copyright ©1997-2006 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trade-
marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are
for identification purposes only and may be trademarks of their respective companies.
November 2, 2006 21444E6
Am29F016D
41
AMD [ AMD ]
