D A T A S H E E T
PHYSICAL DIMENSIONS
VBK048—48 Ball Fine-Pitch Ball Grid Array (FBGA)
8.15 x 6.15 mm
0.10 (4X)
D1
A
D
6
5
4
3
2
1
7
e
SE
E1
E
H
G
F
E
D
C
B
A
INDEX MARK
6
B
A1 CORNER
PIN A1
7
fb
SD
CORNER
10
f
f
0.08M
0.15M
C
C
TOP VIEW
A
B
BOTTOM VIEW
0.10C
0.08C
A2
A
SEATING PLANE
C
A1
SIDE VIEW
NOTES
:
PACKAGE
JEDEC
VBK 048
1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2.ALL DIMENSIONS ARE IN MILLIMETERS
N/A
.
8.15 mm
x
6.15 mm NOM
3.BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEP
AS NOTED).
T
PACKAG
E
SYMBOL
MIN
NOM
MAX
NOTE
4.
e
REPRESENTS THE SOLDER BALL GRID PITCH.
A
A1
A2
D
---
---
1.00 OVERALL THICKNESS
--- BALL HEIGHT
0.76 BODY THICKNESS
BODY SIZE
5.SYMBOL "MD" IS THE BALL ARTORWIXM SIZE IN THE
"D" DIRECTION.
0.18
0.62
---
SYMBOL "ME" IS THE BALL NCOMLAUTMRIX SIZE IN THE
"E" DIRECTION.
---
8.15 BSC.
6.15 BSC.
5.60 BSC.
4.00 BSC.
8
N IS THE TOTAL NUMBER OF SOLDER BALLS.
E
BODY SIZE
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN PLANE PARALLEL TO DATUM C.
D1
E1
MD
ME
N
BALL FOOTPRINT
BALL FOOTPRINT
A
SD AND SE ARE MEASURED WITH RETSOPEDCATTUMS
AND AND DEFINE THE POSOIFTITOHNE CENTER
A
B
ROW MATRIX SIZE
ROW MATRIX SIZE
TOTAL BALL COUNT
0.43 BALL DIAMETER
BALL PITCH
D
DIRECTION
DIRECTION
SOLDER BALL IN THE OUTER ROW.
6
E
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THEEDDOIRMENSION,
RESPECTIVELY, SD OR SE = 0.000.
48
fb
e
0.35
---
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
0.80 BSC.
0.40 BSC.
---
SD
/
SE
SOLDER BALL PLACEMEN
T
8.NOT USED.
DEPOPULATED SOLDER BALLS
9."+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3338 \ 16-038.25b
January 23, 2007 27546A6
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43
AMD [ AMD ]
