D A T A S H E E T
Valid Combinations for FBGA Packages
Revision C+2 (June 11, 2002)
Added WCD, and WCF to Order Number column, and
added D, and F to Package Marking column.
Secured Silicon (SecSi) Sector Flash Memory
Region
Deleted reference to A-1 not being used in addressing,
and to address bits that are don’t cares. In Table 7,
changed lower address bit for user-defined code to 08h
(word mode) and 010h (byte mode).
Revision C4 (July 13, 2005)
Global
Deleted 90 ns speed option.
Ordering Information
Revision C+3 (November 1, 2004)
Global
Deleted options for extended temperature range in Pb-
free packages.
Added colophon and reference links.
Revision C5 (January 23, 2007)
Erase and Program Operations table
Changed tBUSY to a maximum specification.
Ordering Information
Added temperature ranges for Pb-free Package
Valid Combinations for TSOP Packages
Added ED, and EF combinations.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion Inc. will not be liable
to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign
Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-
thorization by the respective government entity will be required for export of those products.
Trademarks
Copyright ©1998–2005 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trade-
marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are
for identification purposes only and may be trademarks of their respective companies.
Copyright © 2006–2007 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations
thereof are trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.
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Am29SL160C
21635C5 January 23, 2007
AMD [ AMD ]
