“CROSSBOW” 32 X 32 800 MBIT/S CROSSPOINT SWITCH
S2024
Figure 6. 196 LDCC Package
1.250 ±.015.
.420 ± .010
148
147
196
1
.105 ±.010
1.350 ±.010
99
98
49
50
.290 min
.055 ± .010
COPLANAR TO .004
.045 ± .005
.008 ± .002
.025 ± .002
1.550
± .015
Non-conductive Tie-bar*
TOP VIEW
All dimensions nominal in inches.
*Trim non-conductive tie-bar prior to board attachment.
Table 5. Thermal Management
Symbol
Θjc
Description
Airflow
Value
2.3
Units
oC/W
oC/W
Thermal resistance from junction to case
Thermal resistance from junction to ambient
Θjc
Θjc
Still air
25.6
Thermal resistance from junction to ambient
with heatsink
400
LFPM
4.8
oC/W
Note: S2024 requires an AMCC heatsink 45-10 with an airflow of 400 LFPM for operation over commercial temperatures.
10
June 15, 1999 / Revision B
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
