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S2021B 参数 Datasheet PDF下载

S2021B图片预览
型号: S2021B
PDF下载: 下载PDF文件 查看货源
内容描述: [Telecom Circuit, 1-Func, BICMOS, PQFP208, THERMALLY ENHANCED, PLASTIC, PACKAGE-208]
分类和应用: 电信信息通信管理电信集成电路
文件页数/大小: 23 页 / 239 K
品牌: AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
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S2020/S2021  
HIPPI SOURCE/DESTINATION INTERFACE CIRCUITS  
Figure 10. Interconnect (output) Network  
From Interconnect Output  
To HIPPI Cable  
Interconnect Signal  
(K–17, SDIC OF S2020  
N–2 DSIC OF S2021  
+5V  
VCC  
220 Ohm  
2%  
10K  
5%  
2N3905  
PNP or  
Equivalent  
N-CHANNEL MOSFET  
W/R ON < 5 Ohm  
VGS = 5V e.g.  
VN0300L, MFE990  
5%  
2.2K  
5%  
2.2K  
GND  
VEE -5.2V  
Figure 11. Interconnect (input) Network  
Silicon  
Junction Diodes*  
1005%  
From HIPPI Cable  
Interconnect Signal  
To Interconnect Input  
(A-15, DSIC of S2020  
C-14, SDIC of S2021)  
220Ω  
5%  
.01µ Fd  
VBB  
(C-13 of S2020  
B-13 of S2021)  
GND  
GND  
330 to  
500Ω  
*IN914 or IN4148  
VEE -5.2  
ORDERING INFORMATION  
GRADE  
FUNCTION  
PACKAGE  
2020 — Hippi Source  
2021 — Hippi Destination  
2022 — Hippi Evaluation Kit  
(contains 2 source and 2  
destination parts)  
A = 225 PGA  
B = 208 TEP  
S-Commercial  
X XXXX X  
22  
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