QT2022/32 - Data Sheet: DS3051
Table 56: 190B LBGA Package Constants
Parameter
Description
Min Typ Max Units
Conditions/Notes
Junction-to-Case Thermal Resistance
12.3
22.7
oC/W
oC/W
θ
JC
Junction-to-Ball Thermal Resistance
Calculated using boundary conditions
defined in JESD51-8.
θ
JB
Junction-to-Ambient Thermal Resistance
32.7
oC/W
With natural convection only, no heat sink or
air flow
θ
JA
29.5
28.2
1 m/s air flow, no heat sink.
2 m/s air flow, no heat sink.
Note that θJB was calculated using boundary conditions defined in JESD51-8. Note that θJA was calculated using
a 1S2P multi-layer JEDEC standard PCB (FR-4, 4” x 4”, 0.063” thick) under forced convection with 0.5m/s
(100LFM) airflow.
Table 57: General CMOS I/O DC Parameters
Parameter
Description
output low voltage
Min
Typ
Max
0.2
Units
V
Conditions
Vol
Ioff
Iol
Iol = 4mA
at 2.5V
Open-drain output off-state leakage
output low current
2.5
μA
mA
V
8
Vol = 0.6V
Vih
Vil
input high voltage level
input low voltage level
0.84
3.3V tolerant
0.36
95
V
Rpd
input pad pulldown resistance
See Table 3 on page 13 for a list of pads
with pulldowns
30
50
kΩ
Rpu
Hyst
input pad pullup resistance
See Table 3 on page 13 for a list of pads
with pullups
21
14
30
36
24
50
80
49
46
95
kΩ
TDI,TMS
TRST_N, RESETN
all other pads with pullups
hysteresis
mV
Applies to RESETN, TRST_N,
EEPROM_SCL and
EEPROM_SDA pins
35
Applies to MDC, TMS, TDCC,
TCK and TDI pins
Cio
input / output capacitance
3.5
5
pF
Vio(dc) = 0.6V
Table 58: LED1, LED2, LED3 Output DC Parameters
Parameter
Description
output low voltage level
Min
Typ
Max
Units
Conditions/Notes
Vol
0.4
V
sinking 10mA
188
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