QT2022/32 - Data Sheet: DS3051
3 Available Package Options
The body of the QT2022/32 package complies with the RoHS directive for elimination of banned materials. The sol-
der balls are composed of a SnAgCu alloy, which requires a hotter thermal reflow profile for die attach.
The adoption of a hotter reflow profile for the Pb-free solder presents practical difficulties in manufacturing. To ease
the transition to RoHS compliant products for our customers, the product is also available with standard Sn63%
/
Pb37% solder balls.
The order codes for the products with leaded and lead-free solder balls are listed in Table 79 on page 219.
10
AppliedMicro - Confidential & Proprietary
Revision 5.11
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
