Revision 1.21 – June 22, 2012
PPC440GX Embedded Processor
Data Sheet
Package Thermal Specifications
Table 10. Package Thermal Specifications
Thermal resistance values for the CBGA and PBGA packages in a convection environment are as follows:
Airflow
ft/min (m/sec)
Parameter
Symbol
Package
Unit
Notes
0 (0)
<0.1
1.2
100 (0.51)
<0.1
200 (1.02)
<0.1
Ceramic
Plastic
°C/W
°C/W
°C/W
°C/W
1
Junction-to-case thermal resistance
θJC
1.2
1.2
1, 3
2
Ceramic
Plastic
18.9
17.7
16.3
Case-to-ambient thermal resistance (w/o heat
sink)
θCA
20.8
2, 3
Range
Nom
Min
Max
Ceramic
Plastic
1.5
2.2
°C/W
°C/W
4
Junction-to-ball (typical)
θJB
8.2
Notes:
1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
2. The case-to-ambient thermal resistance is measured in a JEDEC JESD51-6 standard environment; and may not accurately predict
thermal performance in production equipment environments. The operational case temperature must be maintained.
3. Modeled on standard JEDEC 2S2P card, 50x50mm
4. 1.5 °C/W is the theoretical θJB using an infinite heat sink. The larger number applies to the module mounted on a 1.8mm thick, 2P card
using 1oz. copper power planes, with an effective heat transfer area of 75mm2.
60
AppliedMicro Proprietary
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
