Revision 1.29 – May 07, 2008
440EP – PPC440EP Embedded Processor
Data Sheet
Assembly Recommendations
Table 3. Recommended Reflow Soldering Profile
Profile Feature
Average ramp-up rate
Preheat
Sn-Pb Eutectic Assembly
Pb Free Reflow Assembly
3°C/second max
3°C/second max
–
–
–
Temperature Min
Temperature Max
Time (min to max)
100°C
150°C
60-120 Seconds
150°C
180°C
60-120 Seconds
Time Maintained Above:
–
Temperature
183°C
230°C
60-150 Seconds
30-50 Seconds
–
Time
Peak Temperature
225 +0/-5°C
260 +5/-0°C
Time within 5°C of Actual Peak Temperature
Ramp-down Rate
10-30 Seconds
6°C/Second Max
6 Minutes Max
10-20 Seconds
6°C/Second Max
8 Minutes Max
Time 25°C to Peak Temperature
Table 4. JEDEC Moisture Sensitivity Level and Ball Composition
Sn-Pb Eutectic Assembly
Pb Free Reflow Assembly
MSL Level
3
3
Solder Ball Metallurgy
63Sn/37Pb
Sn/4Ag/05Cu
18
AMCC Proprietary
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
