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PPC405GPR-3KB400Z 参数 Datasheet PDF下载

PPC405GPR-3KB400Z图片预览
型号: PPC405GPR-3KB400Z
PDF下载: 下载PDF文件 查看货源
内容描述: Power PC的405GPr嵌入式处理器 [Power PC 405GPr Embedded Processor]
分类和应用: PC
文件页数/大小: 57 页 / 1081 K
品牌: AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
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Revision 2.04 – September 7, 2007  
405GPr – Power PC 405GPr Embedded Processor  
Data Sheet  
Absolute Maximum Ratings  
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause  
permanent damage to the device  
Characteristic  
Supply Voltage (Internal Logic)  
Symbol  
Value  
Unit  
V
VDD  
0 to +1.95  
OVDD  
AVDD  
VIN  
Supply Voltage (I/O Interface)  
PLL Supply Voltage  
0 to +3.6  
V
0 to +1.95  
V
-0.6 to VDD + 0.45  
-0.6 to OVDD + 0.6  
-0.6 to OVDD + 2.4  
Input Voltage (1.8V CMOS receivers)  
Input Voltage (3.3V LVTTL receivers)  
Input Voltage (5.0V LVTTL receivers)  
Storage Temperature Range  
Case temperature under bias  
V
VIN  
V
VIN  
V
TSTG  
TC  
-55 to +150  
-40 to +120  
°C  
°C  
Notes:  
1. All specified voltages are with respect to GND.  
2. Empirical data indicates that all chip voltages should begin to ramp-up within 1 ms of each other. There should never be voltage present  
at the I/O pins before OVDD is within operating range.  
Package Thermal Specifications  
The PPC405GPr is designed to operate within a case temperature range of -40°C to +85°C3. Thermal resistance values for the  
E-PBGA packages (leaded and lead-free) in a convection environment are as follows:  
Airflow  
ft/min (m/sec)  
Symbol  
Package—Thermal Resistance  
Unit  
0 (0)  
100 (0.51)  
200 (1.02)  
35mm, 456-balls—Junction-to-Case  
θJC  
θCA  
θJC  
θCA  
2
2
2
°C/W  
°C/W  
°C/W  
°C/W  
35mm, 456-balls—Case-to-Ambient1  
27mm, 456-balls—Junction-to-Case  
14  
2
13  
2
12  
2
27mm, 456-balls—Case-to-Ambient1  
18  
16  
15  
Notes:  
1. For a chip mounted on a JEDEC 2S2P card without a heat sink.  
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:  
a. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.  
b. TA = TC – P×θCA, where TA is ambient temperature and P is power consumption.  
c. TCMax = TJMax – P×θJC, where TJMax is maximum junction temperature and P is power consumption.  
3. 333MHz operated at 266MHz or less can operate at +105°C.  
38  
AMCC  
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