Revision A – August 12, 2004
S3170 – 2.5 Gbps Transimpedance Amplifier
Data Sheet
Figure 3. Bonding Pad Location
1.27 mm (Total Die Size)
1.15 mm (Circuit Die Size)
Y-Axis
VCC
11
VCC
VCC
VCC
10
9
8
12
VCC
RBYPASS
IIN
7
FILT
13
14
15
OUTN
6
5
OUTP
RBYPASS
1
2
3
4
(0,0) Circuit Die Size1
X-Axis
GND GND
GND
GND
Total Die Size2
Pad Size is 94
µm x 94
µm. Area of exposed area is 80 µm x 80 µm.
Die Thickness is 254
µ
m (10 mils)
1. The circuit die size is the smallest possible size of the die. The lower left-hand corner of the circuit die is the
origin of the xy-coordinate system. Pad coordinates indicated in Table 1 are measured from this origin to the
pad's center.
2. The total die size is the largest possible size of the die. It includes a splicing area around the circuit die. The
actual size of any given die may vary in size from the minimum (circuit die) size to the maximum (total die)
size.
4
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AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
