Revision A – August 12, 2004
S3170 – 2.5 Gbps Transimpedance Amplifier
Data Sheet
Table 1. S3170 Pad Assignment and Description
Coordinates [X,Y] (1)
Pin Name
I/O
Pad #
Description
8
9
10
11
12
[868.9, 1051.4]
[669.6, 1051.4]
[470.8, 1051.4]
[271.8, 1051.4]
[90.8, 892.5]
VCC
S
+3.3 V Power supply.
1
2
3
4
[273, 91.4]
[472, 91.4]
[670.8, 91.4]
[870.1, 91.4]
GND
S
Ground.
13
15
[100.925, 702.425]
[90.9, 293.3]
RBYPASS
IIN
I
I
Bypass connection for cathode of photodiode.
PIN diode input.
14
7
[97.575, 473.975]
[1052.3. 777]
Filter capacitor input. A capacitor to ground can be
added at this pad to reduce the low frequency -3 dB
cutoff. (See Design Procedures).
FILT
I
OUTN
OUTP
O
O
6
5
[1049.275, 567.475]
[1049.275, 375.225]
Negative transimpedance amplifier output.
Positive transimpedance amplifier output.
1. The coordinates represent the position of the center of the pad in µm, with respect to the lower left corner of the die.
2. Note: I = Input pin, O = Output pin, S = Supply pin
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AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
