Thermal Resistance
23
Thermal Resistance
Altera follows JEDEC JESD51 series standards to provide thermal resistances. The
purpose of the JESD51 standards is to compare the thermal performance of various
packages under standardized test conditions. While standardized thermal resistances
can help compare the relative thermal performance of different packages, they cannot
apply directly to the many specific applications because JESD51 test conditions may
not match a specific application. Several factors affect the thermal performance of a
device in a user’s application. These include power dissipation in the component;
airflow velocity, direction and turbulence level; power in adjacent components;
two-sided vs. one-sided active component mounting; printed circuit board (PCB)
orientation & construction; and adjacent boards and their power dissipation. It may
be necessary to test or model specific applications. This testing and modeling of a
component user’s specific applications is the user’s responsibility.
JA
(junction-to-ambientthermalresistance)and
JC
(junction-to-case thermal resistance) values for the Altera device families. Altera
reserves the right to make changes to thermal resistances without notice in the future.
lists the mature Altera devices and the associated table locations.
Table 25.
Thermal Resistance
Altera Device
Arria series FPGAs
Stratix series FPGAs
Cyclone series FPGAs
■
■
■
■
■
■
Table Location
Arria GX Devices:
Stratix II Devices:
Stratix Devices:
Cyclone II Devices:
Cyclone Devices:
MAX 9000 Devices:
MAX 7000 Devices:
MAX 3000A Devices:
HardCopy II Devices:
HardCopy Devices:
APEX II Devices:
APEX 20K:
MAX series CPLDs
■
■
HardCopy series ASICs
APEX series FPGAs
ACEX 1K FPGAs
Mercury FPGAs
FLEX series FPGAs
Excalibur FPGAs
■
■
■
■
ACEX 1K Devices:
Mercury Devices:
■
■
■
FLEX 10K Devices:
FLEX 8000 Devices:
FLEX 6000 Devices:
Excalibur Devices:
Altera is transitioning to an industry-standard copper lid for its thermally enhanced
BGA and thermally enhanced Flip Chip FBGA package offerings.
f
For more information, refer to
© December 2011
Altera Corporation