22
Device and Package Cross Reference
Configuration Devices
lists the device name, package type, and number of pins for the
Configuration device family.
1
The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 23.
Configuration Devices
Device
EPC1
EPC2
EPC1064
EPC1213
PDIP, Wire Bond
PLCC, Wire Bond
PLCC, Wire Bond
TQFP, Wire Bond
PDIP, Wire Bond
PLCC, Wire Bond
PDIP, Wire Bond
PLCC, Wire Bond
PDIP, Wire Bond
EPC1441
PLCC, Wire Bond
TQFP, Wire Bond
Package
Pins
8
20
20
32
8
20
8
20
8
20
32
Enhanced Configuration Devices
lists the device name, package type, and number of pins for the Enhanced
configuration device family.
1
The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 24.
Enhanced Configuration Devices
Device
EPC4
EPC8
EPC16
PQFP, Wire Bond
PQFP, Wire Bond
UBGA, Wire Bond
PQFP, Wire Bond
Package
Pins
100
100
88
100
© December 2011
Altera Corporation
ALTERA [ ALTERA CORPORATION ]
