Package Information for Cyclone II Devices
484-Pin Ultra FineLine BGA – Wirebond
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All dimensions and tolerances conform to ASME Y14.5M – 1994.
Controlling dimension is in millimeters.
Pin A1 may be indicated by an ID dot, or a special feature, in its
proximity on package surface.
Tables 15–15 and 15–16 show the package information and package
outline figure references, respectively, for the 484-pin Ultra FineLine
BGA package.
Table 15–15. 484-Pin Ultra FineLine BGA Package Information
Description
Specification
Ordering Code Reference
Package Acronym
U
UBGA
BT
Substrate Material
Solder Ball Composition
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference
Maximum Lead Coplanarity
Weight
MO-216 Variation: BAP-2
0.005 inches (0.12mm)
1.8 g
Moisture Sensitivity Level
Printed on moisture barrier bag
Table 15–16. 484-Pin Ultra FineLine BGA Package Outline Dimensions
Millimeter
Symbol
Min.
Nom.
Max.
A
A1
A2
A3
D
–
–
–
2.20
–
0.20
0.65
–
–
0.80 TYP
19.00 BSC
19.00 BSC
0.50
E
b
0.40
0.60
e
0.80 BSC
Altera Corporation
February 2007
15–15
Cyclone II Device Handbook, Volume 1
ALTERA [ ALTERA CORPORATION ]
