Package Information for Cyclone II Devices
256-Pin FineLine Ball-Grid Array, Option 2 – Wirebond
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All dimensions and tolerances conform to ASME Y14.5M - 1994.
Controlling dimension is in millimeters.
Pin A1 may be indicated by an ID dot, or a special feature, in its
proximity on the package surface.
1
This POD is applicable to the F256 package of the Cyclone II
product only.
Tables 15–11 and 15–12 show the package information and package
outline figure references, respectively, for the 256-pin FineLine BGA
package.
Table 15–11. 256-Pin FineLine BGA Package Information
Description
Specification
Ordering code reference
Package acronym
F
FineLine BGA
BT
Substrate material
Solder ball composition
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference
Maximum lead coplanarity
Weight
MO-192 Variation: AAF-1
0.008 inches (0.20 mm)
1.9 g
Moisture sensitivity level
Printed on moisture barrier bag
Table 15–12. 256-Pin FineLine BGA Package Outline Dimensions
Millimeter
Symbol
Min.
Nom.
Max.
A
A1
A2
A3
D
–
–
–
1.55
–
0.25
1.05 REF
–
–
0.80
0.55
17.00 BSC
17.00 BSC
0.50
E
b
0.40
e
1.00 BSC
Altera Corporation
February 2007
15–11
Cyclone II Device Handbook, Volume 1
ALTERA [ ALTERA CORPORATION ]
