Package Information for Cyclone II Devices
896-Pin FineLine BGA Package – Wirebond
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All dimensions and tolerances conform to ASME Y14.5M - 1994.
Controlling dimension is in millimeters.
Pin A1’s location may be indicated by an ID dot in its proximity on
the package surface.
Tables 15–19 and 15–20 show the package information and package
outline figure references, respectively, for the 896-pin FineLine BGA.
Table 15–19. 896-Pin FineLine BGA Package Information
Description
Specification
Ordering code reference
Package acronym
F
FineLine BGA
BT
Substrate material
Solder ball composition
Regular: 63Sn: 37Pb (typical)
Pb-free: Sn: 3.0Ag: 0.5Cu (typical)
JEDEC outline reference
Maximum lead coplanarity
Weight
MS-034 variation AAN-1
0.008 inches (0.20 mm)
11.5 g
Moisture sensitivity level
Printed on moisture barrier bag
Table 15–20. 896-Pin FineLine BGA Package Outline Dimensions
Dimensions (mm)
Symbol
Min.
Nom.
Max.
A
A1
A2
A3
D
–
0.30
–
–
2.60
–
–
–
2.20
1.80
–
–
31.00 BSC
31.00 BSC
0.60
E
b
0.50
0.70
e
1.00 BSC
Altera Corporation
February 2007
15–19
Cyclone II Device Handbook, Volume 1
ALTERA [ ALTERA CORPORATION ]
