I/O Structure
Figure 4–69. Stratix GX I/O Banks
Notes (1), (2), (3)
DQST9 DQST8 DQST7 DQST6 DQST5
PLL7 VREF1B3 VREF2B3 VREF3B3 VREF4B3 VREF5B3
Bank 3
DQST4 DQST3 DQST2 DQST1 DQST0
VREF1B4 VREF2B4 VREF3B4 VREF4B4 VREF5B4
Bank 4
PLL5
PLL11
9
10
I/O Bank 13 (5)
I/O Bank 14 (5)
LVDS, LVPECL, 3.3-V PCML,
and HyperTransport I/O Block
and Regular I/O Pins (3)
(4)
I/O Banks 3, 4, 9 & 10 Support
All Single-Ended I/O Standards (2)
I/O Banks 1 and 2 Support All
Single-Ended I/O Standards Except
Differential HSTL Output Clocks,
Differential SSTL-2 Output Clocks,
HSTL Class II, GTL, SSTL-18 Class II,
PCI, PCI-X, and AGP 1×/2×
PLL1
PLL2
I/O Bank 17 (5)
1.5-V PCML (5)
I/O Bank 16 (5)
I/O Bank 15 (5)
I/O Banks 7, 8, 11 & 12 Support
All Single-Ended I/O Standards (2)
(4)
LVDS, LVPECL, 3.3-V PCML,
and HyperTransport I/O Block
and Regular I/O Pins (3)
Bank 8
11
12
Bank 7
VREF5B8 VREF4B8 VREF3B8 VREF2B8 VREF1B8
DQSB9 DQSB8 DQSB7 DQSB6 DQSB5
PLL12
VREF5B7 VREF4B7 VREF3B7 VREF2B7 VREF1B7
DQSB4 DQSB3 DQSB2 DQSB1 DQSB0
PLL8
PLL6
Notes to Figure 4–69:
(1) Figure 4–69 is a top view of the Stratix GX silicon die.
(2) Banks 9 through 12 are enhanced PLL external clock output banks.
(3) If the high-speed differential I/O pins are not used for high-speed differential signaling, they can support all of the
I/O standards except HSTL class I and II, GTL, SSTL-18 Class II, PCI, PCI-X, and AGP 1×/2×.
(4) For guidelines for placing single-ended I/O pads next to differential I/O pads, see the Selectable I/O Standards in
Stratix & Stratix GX Devices chapter in the Stratix GX Device Handbook, Volume 2.
(5) These I/O banks in Stratix GX devices also support the LVDS, LVPECL, and 3.3-V PCML I/O standards on reference
clocks and receiver input pins (AC coupled)
4–116
Altera Corporation
February 2005
Stratix GX Device Handbook, Volume 1
ALTERA [ ALTERA CORPORATION ]
