Features
Stratix devices are available in space-saving FineLine BGA® and ball-grid
array (BGA) packages (see Tables 1–3 through 1–5). All Stratix devices
support vertical migration within the same package (for example, you
can migrate between the EP1S10, EP1S20, and EP1S25 devices in the 672-
pin BGA package). Vertical migration means that you can migrate to
devices whose dedicated pins, configuration pins, and power pins are the
same for a given package across device densities. For I/O pin migration
across densities, you must cross-reference the available I/O pins using
the device pin-outs for all planned densities of a given package type to
identify which I/O pins are migrational. The Quartus® II software can
automatically cross reference and place all pins except differential pins
for migration when given a device migration list. You must use the pin-
outs for each device to verify the differential placement migration. A
future version of the Quartus II software will support differential pin
migration.
Table 1–3. Stratix Package Options & I/O Pin Counts
484-Pin
FineLine
BGA
672-Pin
FineLine
BGA
780-Pin
FineLine
BGA
1,020-Pin
FineLine
BGA
1,508-Pin
FineLine
BGA
672-Pin
BGA
956-Pin
BGA
Device
EP1S10
EP1S20
EP1S25
EP1S30
EP1S40
EP1S60
EP1S80
345
426
473
335
361
345
426
473
426
586
597
597
615
706
726
773
773
773
683
683
683
683
822
1,022
1,203
Note to Table 1–3:
(1) All I/O pin counts include 20 dedicated clock input pins (clk[15..0]p, clk0n, clk2n, clk9n, and clk11n)
that can be used for data inputs.
Table 1–4. Stratix BGA Package Sizes
Dimension
672 Pin
956 Pin
Pitch (mm)
Area (mm2)
1.27
1,225
1.27
1,600
Length × width (mm × mm)
35 × 35
40 × 40
1–4
Altera Corporation
July 2005
Stratix Device Handbook, Volume 1
ALTERA [ ALTERA CORPORATION ]
