Package Information Datasheet for Mature Altera Devices
61
88-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond
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All dimensions and tolerances conform to ASME Y14.5M - 1994.
Controlling dimension is in millimeters.
Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description
Specification
Ordering Code Reference
Package Acronym
Substrate Material
Solder Ball Composition
U
UBGA
BT
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
MO-219
JEDEC Outline
Lead Coplanarity
Weight
0.005 inches (0.12 mm)
0.4 g (Typ.)
Moisture Sensitivity Level
Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min.
Nom.
—
Max.
1.40
—
A
A1
A2
A3
D
—
0.25
0.80
—
—
—
0.70 REF
11.00 BSC
8.00 BSC
0.45
E
b
0.40
0.50
e
0.80 BSC
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices
ALTERA [ ALTERA CORPORATION ]
