Package Information Datasheet for Mature Altera Devices
57
64-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond
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All dimensions and tolerances conform to ASME Y14.5M – 1994.
Controlling dimension is in millimeters.
Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description
Specification
Ordering Code Reference
Package Acronym
Leadframe Material
Lead Finish (plating)
E
EQFP
Copper
Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference
Lead Coplanarity
MS-026 Variation: ABD-HD
0.003 inch (0.08 mm)
0.15 g (Typ.)
Weight
Moisture Sensitivity Level
Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min.
Nom.
—
Max.
1.20
0.15
1.05
A
—
A1
A2
D
0.05
0.95
—
1.00
9.00 BSC
7.00 BSC
D1
D2
3.50
4.50
5.50
E
9.00 BSC
7.00 BSC
E1
E2
3.50
0.45
4.50
0.60
5.50
0.75
L
L1
S
1.00 REF
0.20
—
0.18
—
b
c
e
0.13
0.09
0.23
0.20
—
0.40 BSC
3.5°
0°
7°
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices
ALTERA [ ALTERA CORPORATION ]
