Package Information Datasheet for Mature Altera Devices
63
100-Pin FineLine Ball-Grid Array (FBGA), Option 1—Wire Bond
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All dimensions and tolerances conform to ASME Y14.5M – 1994.
Controlling dimension is in millimeters.
Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the
package surface.
1
This POD is applicable to F100 packages of all products except MAX II, which is
assembled in Option 2 package outlines.
Package Information
Description
Specification
Ordering Code Reference
Package Acronym
Substrate Material
Solder ball composition
F
FBGA
BT
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference
Lead Coplanarity
MO-192 Variation: AAC-1
0.008 inches (0.20mm)
0.6 g (Typ.)
Weight
Moisture Sensitivity Level
Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min.
Nom.
—
Max.
1.70
—
A
A1
A2
A3
D
—
0.30
0.25
—
—
—
1.10
0.80
—
11.00 BSC
11.00 BSC
0.60
E
b
0.50
0.70
e
1.00 BSC
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices