FLEX 10K Embedded Programmable Logic Family Data Sheet
Each FLEX 10K device is functionally tested. Complete testing of each
configurable SRAM bit and all logic functionality ensures 100% yield.
AC test measurements for FLEX 10K devices are made under conditions
equivalent to those shown in Figure 19. Multiple test patterns can be used
to configure devices during all stages of the production flow.
Generic Testing
Figure 19. FLEX 10K AC Test Conditions
Power supply transients can affect AC
measurements. Simultaneous transitions of
multiple outputs should be avoided for
accurate measurement. Threshold tests must
not be performed under AC conditions.
VCC
464 Ω
(703 Ω)
[521 Ω]
Large-amplitude, fast-ground-current
To Test
System
Device
Output
transients normally occur as the device
outputs discharge the load capacitances.
When these transients flow through the
parasitic inductance between the device
ground pin and the test system ground,
significant reductions in observable noise
immunity can result. Numbers without
parentheses are for 5.0-V devices or outputs.
Numbers in parentheses are for 3.3-V devices
or outputs. Numbers in brackets are for
2.5-V devices or outputs.
250 Ω
(8.06 kΩ)
[481 Ω]
C1 (includes
JIG capacitance)
Device input
rise and fall
times < 3 ns
Tables 17 through 21 provide information on absolute maximum ratings,
recommended operating conditions, DC operating conditions, and
capacitance for 5.0-V FLEX 10K devices.
Operating
Conditions
Table 17. FLEX 10K 5.0-V Device Absolute Maximum Ratings
Note (1)
Symbol
Parameter
Conditions
Min
Max
Unit
V
V
Supply voltage
With respect to ground (2)
–2.0
–2.0
–25
–65
–65
7.0
7.0
V
CC
I
DC input voltage
V
I
DC output current, per pin
Storage temperature
Ambient temperature
Junction temperature
25
mA
° C
° C
° C
° C
OUT
T
T
T
No bias
150
135
150
135
STG
AMB
J
Under bias
Ceramic packages, under bias
PQFP, TQFP, RQFP, and BGA
packages, under bias
Altera Corporation
43
ALTERA [ ALTERA CORPORATION ]
