FLEX 10K Embedded Programmable Logic Family Data Sheet
FLEX 10KE devices support the SameFrame pin-out feature for
FineLine BGA packages. The SameFrame pin-out feature is the
arrangement of balls on FineLine BGA packages such that the lower-ball-
count packages form a subset of the higher-ball-count packages.
SameFrame pin-outs provide the flexibility to migrate not only from
device to device within the same package, but also from one package to
another. A given printed circuit board (PCB) layout can support multiple
device density/package combinations. For example, a single board layout
can support a range of devices from an EPF10K30E device in a 256-pin
FineLine BGA package to an EPF10K200S device in a 672-pin
FineLine BGA package.
SameFrame
Pin-Outs
The Quartus and MAX+PLUS II software provides support to design
PCBs with SameFrame pin-out devices. Devices can be defined for present
and future use. The MAX+PLUS II software generates pin-outs describing
how to lay out a board to take advantage of this migration (see Figure 16).
Figure 16. SameFrame Pin-Out Example
Printed Circuit Board
Designed for 256-PinFineLine BGA Package
100-Pin
FineLine
BGA
256-Pin
FineLine
BGA
100-Pin FineLine BGA Package
(Reduced I/O Count or
256-Pin FineLine BGA Package
(Increased I/O Count or
Logic Requirements)
Logic Requirements)
Altera Corporation
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