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AS4LC8M8S0-75TC 参数 Datasheet PDF下载

AS4LC8M8S0-75TC图片预览
型号: AS4LC8M8S0-75TC
PDF下载: 下载PDF文件 查看货源
内容描述: 3.3V 4Mx16和8Mx8 CMOS同步DRAM [3.3V 4Mx16 and 8Mx8 CMOS synchronous DRAM]
分类和应用: 存储内存集成电路光电二极管动态存储器
文件页数/大小: 24 页 / 548 K
品牌: ALSC [ ALLIANCE SEMICONDUCTOR CORPORATION ]
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AS4LC8M8S0  
AS4LC4M16S0  
®
Pin descriptions  
Pin  
Name  
Description  
All operations synchronized to rising edge of CLK. It also increments  
the burst counters.  
CLK  
System clock  
Controls CLK input. If CKE is high, the next CLK rising edge is valid.  
If CKE is low, the internal clock is suspended from the next clock  
cycle and the burst address and output states are frozen. Pulling CKE  
low has the following effects:  
all banks idle: Precharge power down and Self refresh.  
row active in any bank: Active power down.  
CKE  
Clock enable  
burst/ access in progress: Clock suspend.  
When in Power down or Self refresh mode, CKE becomes  
asynchronous until exiting the mode.  
Enables or disables device operation by masking or enabling all inputs  
except CLK, CKE, UDQM/ LDQM (×16), DQM (×8).  
CS  
Chip select  
Address  
Row and column addresses are multiplexed. Row address: A0~A11.  
Column address (8M×8): A0~A8. Column address (4M×16):  
A0~A7.  
A0~A11  
Memory cell array is organized in 4 banks. BA0 and BA1 select which  
internal bank will be active during activate, read, write, and  
precharge operations.  
BA0, BA1  
RAS  
Bank select  
Enables row access and precharge operation. When RAS is low, row  
address is latched at the rising edge of CLK.  
Row address strobe  
Enables column access. When CAS is low, starting column address for  
the burst access operation is latched at the rising edge of the CLK.  
CAS  
WE  
Column address strobe  
Write enable  
Enables write operation and row precharge operation.  
Controls I/ O buffers. When DQM is high, output buffers are disabled  
during a read operation and input data is masked during a write  
operation. DQM latency is 2 clocks for Read and 0 clocks for Write.  
For ×16, LDQM controls lower byte (DQ0–7) and UDQM controls  
upper byte (DQ8–15). For ×8, only one DQM controls the 8 DQs.  
UDQM and LDQM are considered same state when referenced as  
DQM.  
×8: DQM  
×16: UDQM/ LDQM  
Output disable/ write  
mask  
Data inputs/ outputs are multiplexed. Data bus for 8M×8 is  
DQ0~DQ7 only.  
DQ0~DQ15  
VDD/ VSS  
Data input/ output  
Power supply/ ground Power and ground for core logic and input buffers.  
Data output power/  
VDDQ/ VSSQ  
Power and ground for data output buffers.  
ground  
7/ 5/ 00  
ALLIANCE SEMICONDUCTOR  
3