Appendix A: HSDL-3612-007/-037 SMT Assembly Application Note
1.0 Solder Pad, Mask and Metal Solder Stencil Aperture
METAL STENCIL
FOR SOLDER PASTE
PRINTING
STENCIL
APERTURE
LAND PATTERN
SOLDER
MASK
PCBA
Figure 1.0. Stencil and PCBA.
1.1 Recommended Land Pattern for HSDL-3612-007/-037
SHIELD SOLDER PAD
Rx LENS
Dim.
mm
2.40
0.70
1.10
2.35
2.80
3.13
4.31
Inches
0.095
0.028
0.043
0.093
0.110
0.123
0.170
Tx LENS
a
e
b
c (pitch)
d
d
e
f
g
b
Y
f
g
a
X
theta
c
10x PAD
FIDUCIAL
FIDUCIAL
Figure 2.0. Top view of land pattern.
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