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HSDL-3003-021 参数 Datasheet PDF下载

HSDL-3003-021图片预览
型号: HSDL-3003-021
PDF下载: 下载PDF文件 查看货源
内容描述: IrDA数据标准低功率115.2 kbit / s的用遥控器红外收发器 [IrDA Data Compliant Low Power 115.2 kbit/s with Remote Control Infrared Transceiver]
分类和应用: 接口集成电路遥控信息通信管理遥控器
文件页数/大小: 21 页 / 321 K
品牌: AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
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Recommended Reflow Profile  
MAX. 260°C  
R3 R4  
255  
230  
220  
200  
R2  
180  
60 sec.  
MAX.  
ABOVE  
220°C  
160  
R1  
R5  
120  
80  
25  
0
50  
100  
150  
200  
250  
300  
t-TIME (SECONDS)  
P1  
HEAT  
UP  
P2  
SOLDER PASTE DRY  
P3  
SOLDER  
REFLOW  
P4  
COOL  
DOWN  
Figure 15. Reflow graph.  
Process  
Symbol  
T  
Maximum T/time  
4°C/s  
Heat Up  
P1, R1  
P2, R2  
P3, R3  
P3, R4  
P4, R5  
25°C to 160°C  
160°C to 200°C  
Solder Paste Dry  
Solder Reflow  
0.5°C/s  
200°C to 255°C (260°C at 10 seconds max.)  
255°C to 200°C  
4°C/s  
–6°C/s  
Cool Down  
200°C to 25°C  
–6°C/s  
The reflow profile is a straight-  
line representation of a nominal  
temperature profile for a con-  
vective reflow solder process.  
The temperature profile is divided  
into four process zones, each  
with different T/time tempera-  
ture change rates. The T/time  
rates detailed in the above table.  
The temperatures are measured  
at the component to printed  
circuit board connections.  
Process zone P2 should be of  
sufficient time duration (60 to  
–120 seconds) to dry the solder  
paste. The temperature is raised  
to a level just below the liquidus  
point of the solder, usually  
200°C (392°F).  
growth within the solder  
connections becomes excessive,  
resulting in the formation of weak  
and unreliable connections. The  
temperature is then rapidly  
reduced to a point below the  
solidus temperature of the solder,  
usually 200°C (392°F), to allow  
the solder within the connections  
to freeze solid.  
Process zone P3 is the solder  
reflow zone. In zone P3, the  
temperature is quickly raised  
above the liquidus point of solder  
to 255°C (491°F) for optimum  
results. The dwell time above the  
liquidus point of solder should be  
between 20 and 60 seconds. It  
usually takes about 20 seconds to  
assure proper coalescence of the  
solder balls into liquid solder and  
the formation of good solder  
Process zone P4 is the cool  
down after solder freeze. The cool  
down rate, R5, from the liquidus  
point of the solder to 25°C (77°F)  
should not exceed –6°C per  
second maximum. This limitation  
is necessary to allow the PC board  
and transceiver’s castellation I/O  
pins to change dimensions evenly,  
putting minimal stresses on the  
HSDL-3003.  
In process zone P1, the PC  
board and I/O pins are heated to  
a temperature of 160°C to  
activate the flux in the solder  
paste. The temperature ramp up  
rate, R1, is limited to 4°C per  
second to allow for even heating  
of both the PC board and  
connections. Beyond a dwell time  
of 60 seconds, the intermetallic  
HSDL-3003 I/O pins.  
12  
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