Moisture Proof Packaging
Baking Conditions
All HSDL-3003 options are
shipped in moisture proof
package. Once opened, moisture
absorption begins.
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
This part is compliant to JEDEC
Level 4.
Package
In reels
In bulk
Temp.
60°C
Time
≥ 48 hours
≥ 4 hours
≥ 2 hours
≥ 1 hour
100°C
125°C
150°C
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
Baking should only be done once.
Recommended Storage Conditions
Storage Temperature 10°C to 30°C
PACKAGE IS
OPENED (UNSEALED)
Relative Humidity
below 60% RH
Time from Unsealing to Soldering
After removal from the bag, the
parts should be soldered within
two days if stored at the recom-
mended storage conditions. If
times longer than 72 hours are
needed, the parts must be stored
in a dry box.
ENVIRONMENT
LESS THAN 25°C,
AND LESS THAN
60% RH?
YES
NO BAKING
IS NECESSARY
NO
PACKAGE IS
OPENED MORE
THAN 72 HOURS?
NO
YES
PERFORM RECOMMENDED
BAKING CONDITIONS
Figure 14. Baking conditions chart.
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AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
