Package Information
Power Dissipation and Thermal Resistance
V
CC
= 3.15 V to 3.45 V
Symbol
P
D
θ
jc[1]
Parameter
Power Dissipation
Thermal Resistance, Junction to Case
Units
mW
°C/W
Typ.
500
7
Max.
640
Note:
1. Based on independent package testing by Agilent.
θ
ja
for this device is 57°C/W
.
θ
ja
is measured on a standard 3x3” FR4 PCB in a still air environment. To
determine the actual junction temperature in a given application, use the following equation:
T
j
= T
c
+ (θ
jc
x P
D
), where T
c
is the case temperature measured on the top center of the package and P
D
is the power being dissipated.
Item
Package Material
Lead Finish Material
Lead Finish Thickness
Lead Skew
Lead Coplanarity (Seating Plane)
Details
Plastic
85% Tin, 15% Lead
200-800 micro-inches
0.33 mm max.
0.10 mm max.
Mechanical Dimensions
PIN #1 ID
1
2
3
4
5
44 43 42 41 40 39 38 37 36 35 34
33
32
31
30
29
6
28
7
27
8
26
9
25
10
24
11
23
12 13 14 15 16 17 18 19 20 21 22
TOP VIEW
E1
E
D1
D
A2
c
A
A1
SEATING
PLANE
b
e
L
0.25
GUAGE
PLANE
ALL DIMENSIONS ARE IN MILLIMETERS
PART NUMBER E1/D1
HDMP-0450
TOLERANCE
10.00
E/D
13.20
b
0.35
e
0.80
L
0.88
c
0.23
A2
2.00
A1
0.25
A
2.45
MAX.
± 0.10 ± 0.20 ± 0.05 BASIC + 0.15/ MAX. + 0.10/ ± 0.25
– 0.10
– 0.05
Figure 7. HDMP-0450 package drawing.
8
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
