Maximum Solder Reflow Thermal Profile
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
1
2
3
4
5
6
7
8
9
10
11
12
Regulatory Information
The HCPL-7840 has been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
TEMPERATURE – °C
∆T
= 100°C, 1.5°C/SEC
CSA
Approved under CSA
Component Acceptance Notice
#5, File CA 88324.
TIME – MINUTES
(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.)
Insulation and Safety Related Specifications
Parameter
Min. External Air Gap
(External Clearance)
Min. External Tracking Path
(External Creepage)
Min. Internal Plastic Gap
(Internal Clearance)
Symbol
L(IO1)
L(IO2)
Value Units
7.1
mm
7.4
0.08
mm
mm
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
CTI
200
IIIa
Volts
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
Supply Voltages
Steady-State Input Voltage
2 Second Transient Input Voltage
Output Voltages
Lead Solder Temperature
(10 sec., 1.6 mm below seating plane)
Solder Reflow Temperature Profile
Symbol
T
S
T
A
V
DD1
, V
DD2
V
IN+
, V
IN-
V
OUT+
, V
OUT-
T
LS
Min.
-55
-40
0.0
-2.0
-6.0
-0.5
Max.
125
85
5.5
V
DD1
+0.5
V
DD2
+0.5
260
Unit
°C
°C
V
V
V
°C
Note
1
See Maximum Solder Reflow Thermal Profile Section
1-250