Regulatory Information
Solder Reflow Thermal Profile
300
The HCPL-x710 have been
approved by the following
organizations:
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
UL
200
100
0
2.5°C ± 0.5°C/SEC.
SOLDERING
TIME
200°C
Recognized under UL 1577,
component recognition program,
File E55361.
30
160°C
150°C
140°C
SEC.
30
SEC.
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
CSA
TIGHT
TYPICAL
LOOSE
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
ROOM
TEMPERATURE
0
50
100
150
200
250
TIME (SECONDS)
IEC/ EN/ DIN EN 60747-5-2
Recommended Pb-Free IR Profile
Approved under:
TIME WITHIN 5 °C of ACTUAL
PEAKTEMPERATURE
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01.
t
p
20-40 SEC.
260 +0/-5 °C
T
T
p
217 °C
L
RAMP-UP
3 °C/SEC. MAX.
RAMP-DOWN
6 °C/SEC. MAX.
(Option 060 only)
150 - 200 °C
T
smax
T
smin
t
s
t
L
60 to 150 SEC.
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
= 200 °C, T = 150 °C
T
smax
smin
Insulation and Safety Related Specifications
Value
0710
Parameter
Symbol
7710
Units
Conditions
Minimum External Air
Gap (Clearance)
L(I01)
7.1
4.9
mm
Measured from input terminals to output
terminals, shortest distance through air.
Minimum External
Tracking (Creepage)
L(I02)
CTI
7.4
4.8
mm
Measured from input terminals to output
terminals, shortest distance path along
body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
Minimum Internal Plastic
Gap (Internal Clearance)
0.08
≥175
IIIa
0.08
≥175
IIIa
mm
Tracking Resistance
(Comparative Tracking
Index)
Volts
DIN IEC 112/ VDE 0303 Part 1
Isolation Group
Material Group (DIN VDE 0110, 1/ 89,
Table 1)
board, minimum creepage and
clearance requirements must be
met as specified for individual
equipment standards. For
creepage, the shortest distance
path along the surface of a
printed circuit board between the
solder fillets of the input and
output leads must be considered.
There are recommended
All Agilent data sheets report the
creepage and clearance inherent
to the optocoupler component
itself. These dimensions are
needed as a starting point for the
equipment designer when
determining the circuit insulation
requirements. However, once
mounted on a printed circuit
techniques such as grooves and
ribs which may be used on a
printed circuit board to achieve
desired creepage and clearances.
Creepage and clearance distances
will also change depending on
factors such as pollution degree
and insulation level.
4
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
