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OR3T55-6BA256 参数 Datasheet PDF下载

OR3T55-6BA256图片预览
型号: OR3T55-6BA256
PDF下载: 下载PDF文件 查看货源
内容描述: 3C和3T现场可编程门阵列 [3C and 3T Field-Programmable Gate Arrays]
分类和应用: 现场可编程门阵列可编程逻辑
文件页数/大小: 210 页 / 4391 K
品牌: AGERE [ AGERE SYSTEMS ]
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Data Sheet  
June 1999  
ORCA Series 3C and 3T FPGAs  
Special Function Blocks (continued)  
s
TMS TDI  
TCK  
TDO  
TMS TDI  
TCK  
Boundary Scan  
net a  
TDO  
net b  
U2  
U2  
net c  
The increasing complexity of integrated circuits (ICs)  
and IC packages has increased the difficulty of testing  
printed-circuit boards (PCBs). To address this testing  
problem, the IEEE standard 1149.1/D1 (IEEE Standard  
Test Access Port and Boundary-Scan Architecture) is  
implemented in the ORCA series of FPGAs. It allows  
users to efficiently test the interconnection between  
integrated circuits on a PCB as well as test the inte-  
grated circuit itself. The IEEE 1149.1/D1 standard is a  
well-defined protocol that ensures interoperability  
among boundary-scan (BSCAN) equipped devices  
from different vendors.  
TDI  
TMS  
TCK  
TDO  
TMS TDI  
TCK  
TDO  
TMS TDI  
TCK  
TDO  
U3  
U4  
SEE ENLARGED VIEW BELOW  
The IEEE 1149.1/D1 standard defines a test access  
port (TAP) that consists of a four-pin interface with an  
optional reset pin for boundary-scan testing of inte-  
grated circuits in a system. The ORCA Series FPGA  
provides four interface pins: test data in (TDI), test  
mode select (TMS), test clock (TCK), and test data out  
(TDO). The PRGM pin used to reconfigure the device  
also resets the boundary-scan logic.  
TDO TCK TMS TDI  
TAPC  
PT[ij]  
BSC  
BDC DCC  
SCAN  
IN  
SCAN  
OUT  
BYPASS  
REGISTER  
INSTRUCTION  
REGISTER  
p_in  
p_ts  
p_out  
SCAN  
OUT  
SCAN  
IN  
p_ts  
PR[ij]  
BSC  
DCC  
p_in  
BSC  
BDC  
The user test host serially loads test commands and  
test data into the FPGA through these pins to drive out-  
puts and examine inputs. In the configuration shown in  
Figure 36, where boundary scan is used to test ICs,  
test data is transmitted serially into TDI of the first  
BSCAN device (U1), through TDO/TDI connections  
between BSCAN devices (U2 and U3), and out TDO of  
the last BSCAN device (U4). In this configuration, the  
TMS and TCK signals are routed to all boundary-scan  
ICs in parallel so that all boundary-scan components  
operate in the same state. In other configurations, mul-  
tiple scan paths are used instead of a single ring. When  
multiple scan paths are used, each ring is indepen-  
dently controlled by its own TMS and TCK signals.  
PLC  
ARRAY  
p_out  
p_in  
p_out  
p_ts  
BDC  
DCC  
PL[ij]  
SCAN  
IN  
SCAN  
OUT  
p_out  
p_ts  
p_in  
BSC  
DCC BDC  
SCAN  
OUT  
SCAN  
IN  
PB[ij]  
5-5972(F)  
Key: BSC = boundary-scan cell, BDC = bidirectional data cell,  
and DCC = data control cell.  
Figure 36. Printed-Circuit Board with Boundary-  
Scan Circuitry  
Figure 37 provides a system interface for components  
used in the boundary-scan testing of PCBs. The three  
major components shown are the test host, boundary-  
scan support circuit, and the devices under test  
(DUTs). The DUTs shown here are ORCA Series  
FPGAs with dedicated boundary-scan circuitry. The  
test host is normally one of the following: automatic test  
equipment (ATE), a workstation, a PC, or a micropro-  
cessor.  
Lucent Technologies Inc.  
57