Data Sheet
June 1999
ORCA Series 3C and 3T FPGAs
Package Outline Diagrams (continued)
352-Pin PBGA
Dimensions are in millimeters.
35.00 ± 0.20
+0.70
30.00
–0.00
A1 BALL
IDENTIFIER ZONE
+0.70
30.00
–0.00
35.00
± 0.20
MOLD
COMPOUND
PWB
1.17 ± 0.05
0.56 ± 0.06
2.33 ± 0.21
SEATING PLANE
0.20
SOLDER BALL
25 SPACES @ 1.27 = 31.75
0.60 ± 0.10
AF
AE
AD
AC
AB
AA
Y
W
0.75 ± 0.15
V
U
T
R
P
N
25 SPACES
@ 1.27 = 31.75
M
L
K
J
H
G
F
E
D
C
CENTER ARRAY
FOR THERMAL
ENHANCEMENT
(OPTIONAL)
(SEE NOTE BELOW)
B
A
1 2 3
4
5 6
7
8 9 10 12 14 16 18 20 22 24 26
11 13 15 17 19 21 23 25
A1 BALL
CORNER
5-4407(F)
Note: Although the 36 thermal enhancement balls are stated as an option, they are standard on the 352 FPGA package.
Lucent Technologies Inc.
203
AGERE [ AGERE SYSTEMS ]
