Data Sheet
June 1999
ORCA Series 3C and 3T FPGAs
Package Outline Diagrams (continued)
256-Pin PBGA
Dimensions are in millimeters.
27.00 ± 0.20
+0.70
24.00
–0.00
A1 BALL
IDENTIFIER ZONE
+0.70
–0.00
24.00
27.00
± 0.20
MOLD
COMPOUND
PWB
1.17 ± 0.05
2.13 ± 0.19
0.36 ± 0.04
SEATING PLANE
0.20
SOLDER BALL
19 SPACES @ 1.27 = 24.13
0.60 ± 0.10
Y
W
V
U
T
R
P
0.75 ± 0.15
N
M
L
K
J
19 SPACES
@ 1.27 = 24.13
H
G
F
CENTER ARRAY
FOR THERMAL
E
D
C
B
A
ENHANCEMENT
(OPTIONAL)
(SEE NOTE BELOW)
1
2
3 4 5 6
7
8 9 10 12 14 16 18 20
11 13 15 17 19
A1 BALL
CORNER
5-4406(F)
Note: Although the 16 thermal enhancement balls are stated as an option, they are standard on the 256 FPGA package.
202
Lucent Technologies Inc.
AGERE [ AGERE SYSTEMS ]
